Forskjell mellom versjoner av «Ec-reflow-mate»
(eC-reflow-pilot installed on the dedicated laptop on the top shelf.) |
(→Bruk) |
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| Linje 20: | Linje 20: | ||
When precise temperature readings on the PCB are required, place the external sensor thermocouple directly to the PCB in order to measure the temperature on its surface. Secure it with Kaptopn tape or solder it using solder wire with high melting tmperature to the top or the bottom of the PCB. | When precise temperature readings on the PCB are required, place the external sensor thermocouple directly to the PCB in order to measure the temperature on its surface. Secure it with Kaptopn tape or solder it using solder wire with high melting tmperature to the top or the bottom of the PCB. | ||
| − | + | Using the oven: | |
| + | Use the arrow keys to navigate the menu. To select a program, click until you see "Program" in the menu. Select program (1-5) and wait a few seconds for the machine to confirm the selection. To exit the menu, select the Quit-item and press Ok. Then press Ok to start the program. Here's a list of the current programs, their timings and peak temperatures. The first 3 are default programs. | ||
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| + | P1: Goes to 233C over 3.5 min, door open at 175C | ||
| + | P2: Goes to 235C over 4.5 min, door open at 185C | ||
| + | P3: Goes to 235C over 5 min. Door open at 185C | ||
| + | P4: Goes to 249C over 5.5 min, hold for 0,5 min. Door open 185C | ||
| + | P5: 60C only (drying program?) (edited) | ||
| + | |||
| + | == Solder Paste == | ||
| + | |||
| + | Eurocircuit recommends using SAC305 (SnCuNi), a lead free paste that typically melts at around 227°C. It is however not fully melted at this temperature [https://aimsolder.com/technical-articles/reflow-limbo-how-low-can-we-go#:~:text=SAC305%20begins%20to%20melt%20at,temperature%20window%20of%20233%20%E2%80%93%20255. as explained here]: ''SAC305 begins to melt at 217°C, reaching its fully liquid state at approximately 220.6°C. Recommended reflow temperatures are typically at least 13°C higher than melting temperatures; hence the SAC305 peak temperature window of 233 – 255. Applying the 13-degree guideline to the SnCuNi alloy results in a minimum peak temperature recommendation of 240°C. It’s that 7-degree difference in minimum reflow temperatures that generates the fear – of cold joints, incomplete wetting, inconsistent IMC formation or other reliability issues - if the peak temperature of a solder joint falls into that questionable space between 233 and 240°C.'' | ||
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| + | We have done several tests and in general, you have to turn on the Holdtime (in menu) to achieve full wetting at the top temperature. Also be sure to place the board in the middle of the oven since the sides do not heat as much. | ||
| + | |||
| + | [Elias] has tested P2 and it worked with [https://no.mouser.com/ProductDetail/Chip-Quik/TS391SNL50?qs=1mbolxNpo8cg4bdDQtYwxQ%3D%3D TS391SNL50]. [Jensa] has tested P2 with [https://www.digikey.no/en/products/detail/mg-chemicals/4900P-250G/6035719 SAC305/4900P-250G] with disappointing results. Parts of the solder didn't wet at all and all Flux was dried out. Due to this, P4 was changed to have a higher final temperature of 249C to use with this paste. This is consistent with [https://aimsolder.com/technical-articles/reflow-limbo-how-low-can-we-go what Aim Solder writes]. | ||
== Programvare == | == Programvare == | ||
Revisjonen fra 14. mai 2024 kl. 08:05
- Version: V2 or V3
Innhold
Tekniske spesifikasjoner
- Heating method: Infrared heating
- Maximum operating height: 2000m
- Power: 3000W
- Net weight: 35kg
- Dimensions of the oven: 62,5cm x 48,5cm x 23,5cm
- Dimensions of the oven with hood: 62.5cm x 66,0cm x 26,0cm
- Control options: via display or via computer(Windows) connected with USB
- Maximum PCB size: 350x250mm(LxW)
- Operational voltage: 230V
- Operating temperature: 260°C (500°F) - measured on the top side of the PCB
- Ambient temperature: 5°C - 40°C (41°F - 104°F)
- Fuse: ESKA: 6,3x32mm 16A 230V, delayed
Bruk
You need to place the PCB centrally in the oven between the top and bottom sensors. It is very important that the PCB is placed under the sensor so that the sensor does not receive any radiated heat from the preheater (bottom) IR-lamps.This ensures that the temperature control will function properly.
When precise temperature readings on the PCB are required, place the external sensor thermocouple directly to the PCB in order to measure the temperature on its surface. Secure it with Kaptopn tape or solder it using solder wire with high melting tmperature to the top or the bottom of the PCB.
Using the oven: Use the arrow keys to navigate the menu. To select a program, click until you see "Program" in the menu. Select program (1-5) and wait a few seconds for the machine to confirm the selection. To exit the menu, select the Quit-item and press Ok. Then press Ok to start the program. Here's a list of the current programs, their timings and peak temperatures. The first 3 are default programs.
P1: Goes to 233C over 3.5 min, door open at 175C P2: Goes to 235C over 4.5 min, door open at 185C P3: Goes to 235C over 5 min. Door open at 185C P4: Goes to 249C over 5.5 min, hold for 0,5 min. Door open 185C P5: 60C only (drying program?) (edited)
Solder Paste
Eurocircuit recommends using SAC305 (SnCuNi), a lead free paste that typically melts at around 227°C. It is however not fully melted at this temperature as explained here: SAC305 begins to melt at 217°C, reaching its fully liquid state at approximately 220.6°C. Recommended reflow temperatures are typically at least 13°C higher than melting temperatures; hence the SAC305 peak temperature window of 233 – 255. Applying the 13-degree guideline to the SnCuNi alloy results in a minimum peak temperature recommendation of 240°C. It’s that 7-degree difference in minimum reflow temperatures that generates the fear – of cold joints, incomplete wetting, inconsistent IMC formation or other reliability issues - if the peak temperature of a solder joint falls into that questionable space between 233 and 240°C.
We have done several tests and in general, you have to turn on the Holdtime (in menu) to achieve full wetting at the top temperature. Also be sure to place the board in the middle of the oven since the sides do not heat as much.
[Elias] has tested P2 and it worked with TS391SNL50. [Jensa] has tested P2 with SAC305/4900P-250G with disappointing results. Parts of the solder didn't wet at all and all Flux was dried out. Due to this, P4 was changed to have a higher final temperature of 249C to use with this paste. This is consistent with what Aim Solder writes.
Programvare
Dokumentasjon
- Dokumentasjon: https://www.eurocircuits.com/ec-equipment-ec-reflow-mate/
- Operator manual[3]
- Safety instructions[4]
Historikk
- 2022-11-10
- installed eC-reflow-pilot on the laptop on top shelf, and connected it to the oven (com port COM3). Testyed by open the oven door with eC-reflow-pilot, and downloading the profiles from the oven. The software works. Tingo (diskusjon) 10. nov. 2022 kl. 21:23 (CET)
